Total Solution for Semiconductor IC Test Socket, Spring Contact Probe, WLP Probe Card, ATE Load Board, Burn-in Test Scoket

Qualmax - Proven Full Service Company for Semiconductor IC Test Socket

BGA Socket / LGA SocketRF Device SocketSpecial SocketQFN Socket / MLF SocketPOP Socket /
PIP Socket
QFP SocketMemory Device SocketElastomeric Socket, Contactor LidCustom Support Plate, Change Kit 

BGA Socket / LGA Socket 

Qualmax can supply with variety of test socket for BGA/LGA packages. Pin count as many as 
3,000 and the device pitch as small as 0.3mm. Followings are some examples.


145pin BGA Socket    

145 pin BGA Socket

       Package type: BGA 145pin

         Socket size:24mm(W)*24mm(L)*5mm(t)
         Socket Material:Torlon 4XG 
         Package size: 6mm(W)*6mm(L)*0.4mm(t)
         Spring Force:18.6g(.66Oz)
         Recommended travel:0.40mm(.0157") 
         Full travel:0.53mm(.0209")  
         Current rating:2.0A continuous
         Self inductance:0.28nH
         Capacitance:0.50pF
         Bandwidth:42.42GHz@-3.02dB
         Mutual inductance:0.37nH
         Propagation delay:15.63ps
         Insertion loss:-1.002dB@9.055GHz

 

 

 

 

 

 

 

 

 

 

 

 


144 pin BGA Socket  

144 pin BGA Socket

    Package type: BGA 144pin
    Socket size:29.5mm(W)*29.5mm(L)*10mm(t)
    Socket Material:Torlon 4203 
    Package size: 8mm(W)*8mm(L)*0.5mm(t)
    Spring Force:40.0g(1.41Oz)
    Recommended travel:0.40mm(.0157")              
    Full travel:0.68mm(.0197")
    Current rating:2.0A continuous
    Self inductance:0.70nH
    Capacitance:0.72pF
    Bandwidth:26.26GHz@-3.09dB
    Mutual inductance:0.53nH
    Propagation delay:37.11ps
    Insertion loss:25.05GHz@-1.008dB

 

 

 

 

 

 

 

 

 

 

 


409 pin BGA Socket

409 pin BGA Socket         

    Package type: BGA 409pin
    Socket size:60.0mm(W)*140.0mm(L)*9.05mm(t)
    Socket Material:Torlon 4203
    Package size: 12mm(W)*12mm(L)*0.5mm(t)
    Spring Force:40.0g(1.41Oz)
    Recommended travel:0.40mm(.0157")
    Full travel:0.68mm(.0197")
    Current rating:2.0A continuous
    Self inductance:0.70nH
    Capacitance:0.72pF
    Bandwidth:26.26GHz@-3.09dB
    Mutual inductance:0.53nH
    Propagation delay:37.11ps
    Insertion loss:25.05GHz@-1.008dB

 

 

 

 

 

 

 

 

 

 


1017 pin BGA Socket   

1017 pin BGA Socket       

    Package type: BGA 1017pin
    Socket size:70.0mm(W)*70.0mm(L)*7.62mm(t)
    Socket Material:Torlon 5530
    Package size: 35mm(W)*35mm(L)*1.0mm(t)
    Spring Force:29.0g(1.02Oz)
    Recommended travel:0.72mm(.0283")
    Full travel:0.87mm(.0343")
    Current rating:4.0A continuous
    Self inductance:1.17nH
    Capacitance:0.54pF
    Bandwidth:35.55GHz@-3.09dB
    Propagation delay:30.30ps

 

 

 

 

 

 

 

 

 

 

 


Qualmax also offers Burn-in Test Socket, ATE Load Board (DUT Board), WLP Probe Card and wide
range of
Spring Contact Probe.

     

 

Special Sale:
See our inventory liquidation sale. Huge savings!

New Products

Micro Conctact Vertical Probe Card (MCVPC) for Wafer Level Package Test

Solid Pd Alloy Probes for Critical Lead Free Applications

RF Coaxial Test Socket

BK Series Elastomeric Socket     

Press Release:Qualmax now offers design engineering support in the U.S.

Download Qualmax Corporate Brochure

See us at International Test Conference 2010

See us at BITS 2010

 

Please e-mail to info@qualmax.com for your Semciconductor Test Socket or Spring Contact Probe needs.
Qualmax provides Semiconductor Test Socket, Spring Contact Probe, WLP Probe Card, Burn-in Test
Socket
and ATE Load Board (DUT Board)  to the semiconductor test industry.