Total Solution for Semiconductor IC Test Socket, Spring Contact Probe, Wafer Probe Card, ATE Load Board, Burn-in Socket and High Density Coaxial Connector

Qualmax - Proven Full Service Company for Semiconductor IC Test Socket

BGA Socket / LGA Socket    RF Device Socket     Special Socket     QFN Socket / MLF Socket    POP Socket /
PIP Socket
     QFP Socket    Memory Device Socket    Elastomeric Socket    Contactor Lid    Custom Support Plate

BGA Socket / LGA Socket 

Qualmax can supply with variety of test socket for BGA/LGA packages. Pin count as many as 
3,000 and the device pitch as small as 0.3mm. Followings are some examples.


    

144 pin BGA Socket

 

       Package type: BGA 145pin

         Socket size:24mm(W)*24mm(L)*5mm(t)
         Socket Material:Torlon 4XG 
         Package size: 6mm(W)*6mm(L)*0.4mm(t)
         Spring Force:18.6g(.66Oz)
         Recommended travel:0.40mm(.0157") 
         Full travel:0.53mm(.0209")  
         Current rating:2.0A continuous
         Self inductance:0.28nH
         Capacitance:0.50pF
         Bandwidth:42.42GHz@-3.02dB
         Mutual inductance:0.37nH
         Propagation delay:15.63ps
         Insertion loss:-1.002dB@9.055GHz

 

 

 

 

 

 

 

 

 

 

 

 


 

 

    Package type: BGA 144pin
    Socket size:29.5mm(W)*29.5mm(L)*10mm(t)
    Socket Material:Torlon 4203 
    Package size: 8mm(W)*8mm(L)*0.5mm(t)
    Spring Force:40.0g(1.41Oz)
    Recommended travel:0.40mm(.0157")              
    Full travel:0.68mm(.0197")
    Current rating:2.0A continuous
    Self inductance:0.70nH
    Capacitance:0.72pF
    Bandwidth:26.26GHz@-3.09dB
    Mutual inductance:0.53nH
    Propagation delay:37.11ps
    Insertion loss:25.05GHz@-1.008dB

 

 

 

 

 

 

 

 

 

 


409 pin BGA Socket

409 pin BGA Socket         

    Package type: BGA 409pin
    Socket size:60.0mm(W)*140.0mm(L)*9.05mm(t)
    Socket Material:Torlon 4203
    Package size: 12mm(W)*12mm(L)*0.5mm(t)
    Spring Force:40.0g(1.41Oz)
    Recommended travel:0.40mm(.0157")
    Full travel:0.68mm(.0197")
    Current rating:2.0A continuous
    Self inductance:0.70nH
    Capacitance:0.72pF
    Bandwidth:26.26GHz@-3.09dB
    Mutual inductance:0.53nH
    Propagation delay:37.11ps
    Insertion loss:25.05GHz@-1.008dB

 

 

 

 

 

 

 

 

 

 


1017 pin BGA Socket       

    Package type: BGA 1017pin
    Socket size:70.0mm(W)*70.0mm(L)*7.62mm(t)
    Socket Material:Torlon 5530
    Package size: 35mm(W)*35mm(L)*1.0mm(t)
    Spring Force:29.0g(1.02Oz)
    Recommended travel:0.72mm(.0283")
    Full travel:0.87mm(.0343")
    Current rating:4.0A continuous
    Self inductance:1.17nH
    Capacitance:0.54pF
    Bandwidth:35.55GHz@-3.09dB
    Propagation delay:30.30ps

 

 

 

 

 

 

 

 

 

 


 

     

 

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Please e-mail to info@qualmax.com for your Semciconductor Test Socket or Spring Contact Probe needs.
Qualmax provides Semiconductor Test Socket, Spring Contact Probe, WLP Probe Card, Burn-in Test
Socket
and ATE Load Board (DUT Board)  to the semiconductor test industry.