Qualmax - Proven Full Service Company for Semiconductor IC Test Socket & Spring Contact Probe

Semiconductor IC Test Socket,  Burn-in Test Socket,  ATE Load Board,  WLP Probe Card,  Spring Contact Probe

R&D Achievement : Leeno Industry Inc.

Research Institution Leeno Industrial Inc. Technology Research Laboratory Research Result and Anticipated Effect - It is suitable for testing Vertical Wafer Probe Card and LCD Illumination. Its shorter signal transferring distance compared to previous Blade Method makes it suitable for high speed testing, especially, since high density, vertical arranged mounting is possible, it can increase the yield of test procedures. Product Materialization Description - LCD Illumination Test 89-Pin Interface Block   Research Institution Leeno Industrial Inc. Technology Research Laboratory Research Result and Anticipated Effect -Although, RF Device production is on a constant rise, its steady escalation in testing expense is surfacing as a problem. Therefore, instead of utilizing high cost RF test equipment, testing expense can be greatly reduced by using system-level testers. Utilizing this test socket, Individual devices as well as modulated units can be tested. Product Materialization Description - 2.4GHz~5GHz Wireless LAN Module Test Socket   Research Institution Leeno Industrial Inc. Technology Research Laboratory Research Result and Anticipated Effect - Its toggle type connector allows easy connection to battery polarities and makes it suitable for mass production automated systems. Especially, to make it applicable in testing hybrid vehicle battery, it was developed to withstand up to 50 ampere. Product Materialization Description - Lithium Polymer Battery Test Connector   Research Institution Leeno Industrial Inc. Technology Research Laboratory Research Result and Anticipated Effect - There are many incidents of device damage due to static electricity during testing. We have developed a socket using ESD preventive polymer and a housing unit. It is suitable for safe testing of high cost devices and sensitive Logic semiconductors. Product Materialization Description - 680BGA, 84BGA Socket   Research Institution Leeno Industrial Inc. Technology Research Laboratory, Dong Eui University Electronic Ceramics Center Research Result and Anticipated Effect - With a development of surface treatment process, specified for characteristics of lead and ball of a Pb free device, we have produced a probe that can be used for long durations while maintaining contact resistance. Additionally, with a development of a material that can maintain low resistance, production of high performance probe is feasible. Product Materialization Description - CF Series and GR Series PROBE