Total Solution for Semiconductor IC Test Socket, Spring Contact Probe, Wafer Probe Card, ATE Load Board, Burn-in Socket and High Density Coaxial Connector

Qualmax - Full Proven Service Company for Semiconductor IC Test Socket

BGA Socket / LGA Socket    RF Device Socket     Special Socket     QFN Socket / MLF Socket    POP Socket /
PIP Socket
     QFP Socket    Memory Device Socket    Elastomeric Socket    Contactor Lid    Custom Support Plate

POP Socket / PIP Socket 

The smaller the consumer electronics becomes, the more needs for the 3D packaging or multi-chip module
packaging arise. Qualmax has the capability to address the most chanllenging test requirements
associated with those types of latest packaging technologies. Qualmax has been working closely with
some global accounts, and successfully implemented advanced test sockets for 3D packages or the MCMs.

PoP Socket    PoP Package Socket

* 128FBGA 0.65p
* 152FBGA 0.65p
* 136BGA 0.8p
* 160FBGA 0.5p

     

 

 

 

 

 

 

 

 

 

 

 

 

 

Special Sale:
See our inventory liquidation sale. Huge savings!

New Products

Solid Pd Alloy Probes  

RF Coaxial Test Socket

Elastomeric Socket     

Press Releases

Download Qualmax Corporate Brochure

Trade Shows

See us at BITS 2012

See us at SWTW 2012

 

 

Please e-mail to info@qualmax.com for your Semciconductor Test Socket or Spring Contact Probe needs.
Qualmax provides Semiconductor Test Socket, Spring Contact Probe, WLP Probe Card, Burn-in Test
Socket
and ATE Load Board (DUT Board)  to the semiconductor test industry.