Total Solution for Semiconductor IC Test Socket, Spring Contact Probe, Wafer Probe Card, ATE Load Board, Burn-in Socket and High Density Coaxial Connector

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Semiconductor Test Socket BGA Socket / LGA Socket RF Device Socket Special Socket QFN Socket / MLF Socket POP Socket / PIP Socket QFP Socket Memory Device Socket Elastomer Socket Contactor Lid

Spring Contact Probe

ATE Load Board

Wafer Probe Card

High Density Coaxial Connector

Burn-in Socket

What We Offer

Semiconductor Test Socket
Elastomeric sockets
ATE Load Board
Wafer Probe Card
Spring Contact Probe
Test Socket Lid
Custom Support Plate
Burn-in Socket
Hight Density Coaxial Connector
Application Engineering
Free Custom Design
Technical Support
Local Stocking of Inventory
Supports JIT Manufacturing
Quality Standard Set-up

Our Commitment

Product Excellence
In-depth Application Consulting
Intelligent Design Engineering
Precision Manufacturing
Stringent Quality Control
Two-week Goal for ;
- Design Completion
- Prototype Delivery
- Mass Production Delivery
No NRE Charge
No Tooling Charge
Flexible Approach
Goal Oriented Customer Care

Benefits for You

Highest Quality Product
Best Test Yield
Shortest Lead Time
Shortest Time-to-Market
Competitive Price
Intensive Local Support
One Stop Total Solution

Qualmax - Full Proven Service Company for Semiconductor IC Test Socket

BGA Socket / LGA Socket RF Device Socket Special Socket QFN Socket / MLF Socket POP Socket /
PIP Socket QFP Socket Memory Device Socket Elastomeric Socket Contactor Lid Custom Support Plate
QFP Socket

Qualmax provides with variety of test sockets for QFP packages. Qualmax has experience with pin counts
as many as 3,000 and the device pitch as small as 0.4mm. Followings are some examples.

160pia QFP TestSocket

Package type: QFP 160pin

Socket size:56mm(W)*56mm(L)*8.80mm(t)
Socket Material:Torlon 4203
Package size: 28mm(W)*28mm(L)*0.65mm(t)
Spring Force:35.06g(1.235Oz)
Recommended travel:0.40mm(.0157")
Full travel:0.68mm(.0268")
Current rating:3.0A contineous
Self inductance:0.88nH
Capacitance:0.70pF
Bandwidth:23.04GHz@-3.045dB
Mutual inductance:0.66nH
Propagation delay:49.32ps
Insertion Loss: -1.005db @21.23GHz

64pin QFP Test Socket

Package type: QFP 64pin

Socket size:62.0mm(W)*62.0mm(L)*5.77mm(t)
Socket Material:Torlon QN4XG
Package size: 10mm(W)*10mm(L)*0.5mm(t)
Spring Force:35.0g(1.41Oz)
Recommended travel:0.40mm(.0157")
Full travel:0.68mm(.0197")
Current rating:2.0A contineous
Self inductance:0.70nH
Capacitance:0.72pF
Bandwidth:26.26GHz@-3.09dB
Mutual inductance:0.53nH
Propagation delay:37.11ps
Insertion loss: -1.008dB 25.05GHz

128pin QFP Test Socket

Package type: QFP 128pin
Package size: 36mm(W)*36mm(L)*0.40mm(t)
Lead pitch: 0.4mm
Signal path length: 3.35mm

144pin QFP Test Socket

Package type: QFP 144pin

Package size: 46.4mm(W)*46.4mm(L)*0.5mm(t)
Lead pitch: 0.5mm
Signal path length: 1.65mm

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Please e-mail to info@qualmax.com for your Semciconductor Test Socket or Spring Contact Probe needs.
Qualmax provides Semiconductor Test Socket, Spring Contact Probe, WLP Probe Card, Burn-in Test
Socket and ATE Load Board (DUT Board) to the semiconductor test industry.

Qualmax - Full Proven Service Company for Semiconductor IC Test Socket

BGA Socket / LGA Socket RF Device Socket Special Socket QFN Socket / MLF Socket POP Socket / PIP Socket QFP Socket Memory Device Socket Elastomeric Socket Contactor Lid Custom Support PlateQFP Socket

BGA Socket / LGA Socket RF Device Socket Special Socket QFN Socket / MLF Socket POP Socket / PIP Socket QFP Socket Memory Device Socket Elastomeric Socket Contactor Lid Custom Support Plate

BGA Socket / LGA Socket RF Device Socket Special Socket QFN Socket / MLF Socket POP Socket /
PIP Socket QFP Socket Memory Device Socket Elastomeric Socket Contactor Lid Custom Support Plate
QFP Socket

BGA Socket / LGA Socket RF Device Socket Special Socket QFN Socket / MLF Socket POP Socket /
PIP Socket QFP Socket Memory Device Socket Elastomeric Socket Contactor Lid Custom Support Plate