Total Solution for Semiconductor IC Test Socket, Spring Contact Probe, WLP Probe Card, ATE Load Board, Burn-in Test Scoket

Qualmax - a reliable source of high quality Burn-in Test Socket

Semiconductor IC Test Socket,  Burn-in Test Socket,  ATE Load BoardWLP Probe CardSpring Contact Probe

Burn-in Test Socket

Qualmax provides variety of burn-in test sockets for different packages including
MLP, QFN, MLF, PLCC, CSP, BGA, LGA and etc.

Features 

  • Open top or lidded design
  • Variety of lid options. No "hinge-pitch" problem with zero closing force
  • No damage to solder balls or leads at seating plane
  • Tolerant to package thickness variation upto 0.2mm (BGA)
  • Heat sink available
  • Min pitch : > 0.4mm
  • Center ground pin
  • Accommodating all JEDEC standard footprints
  • Operating temperature: -50 deg C to +150 deg C
  • Insertions: <5.000
  • Socket body material : PPS
  • Various contact pin options
  • Contact resistance: 50mOhms
  • Current rating: upto 3A @25 deg C

picture of various burn-in socket   picture of a BGA burn-in socket   picture of PLCC burn-in socket

Qualmax also offers Burn-in Test Socket, ATE Load Board (DUT Board), WLP Probe Card and wide
range of
Spring Contact Probe.

       

 

 

 

 

 

 

 

 

 

 

 

 

Special Sale:
See our inventory liquidation sale. Huge savings!

New Products

Solid Pd Alloy Probes  

RF Coaxial Test Socket

BK Series Elastomeric Socket     

Press Releases

Download Qualmax Corporate Brochure

Trade Shows

Twelfth Annual BiTS 2011 See us at BITS 2011

 See us at International Test Conference 2011

 

Please e-mail to info@qualmax.com for your Semciconductor Test Socket or Spring Contact Probe needs.
Qualmax provides Semiconductor Test Socket, Spring Contact Probe, WLP Probe Card, Burn-in Test
Socket
and ATE Load Board (DUT Board)  to the semiconductor test industry.