Total Solution for Semiconductor IC Test Socket, Spring Contact Probe, WLP Probe Card, ATE Load Board, Burn-in Test Scoket

Qualmax - a reliable source of high quality Burn-in Test Socket

Semiconductor IC Test Socket,  Burn-in Test Socket,  ATE Load BoardWLP Probe CardSpring Contact Probe

Burn-in Test Socket

Qualmax provides variety of burn-in test sockets for different packages including
MLP, QFN, MLF, PLCC, CSP, BGA, LGA and etc.

Features 

  • Open top or lidded design
  • Variety of lid options. No "hinge-pitch" problem with zero closing force
  • No damage to solder balls or leads at seating plane
  • Tolerant to package thickness variation upto 0.2mm (BGA)
  • Heat sink available
  • Min pitch : > 0.4mm
  • Center ground pin
  • Accommodating all JEDEC standard footprints
  • Operating temperature: -50 deg C to +150 deg C
  • Insertions: <5.000
  • Socket body material : PPS
  • Various contact pin options
  • Contact resistance: 50mOhms
  • Current rating: upto 3A @25 deg C

picture of various burn-in socket   picture of a BGA burn-in socket   picture of PLCC burn-in socket

Qualmax also offers Burn-in Test Socket, ATE Load Board (DUT Board), WLP Probe Card and wide
range of
Spring Contact Probe.

       

 

 

 

 

 

 

 

 

 

 

 

 

Special Sale:
See our inventory liquidation sale. Huge savings!

New Products

Micro Conctact Vertical Probe Card (MCVPC) for Wafer Level Package Test

Solid Pd Alloy Probes for Critical Lead Free Applications

RF Coaxial Test Socket

BK Series Elastomeric Socket     

Press Release:Qualmax now offers design engineering support in the U.S.

Download Qualmax Corporate Brochure

See us at International Test Conference 2010

See us at BITS 2010

 

Please e-mail to info@qualmax.com for your Semciconductor Test Socket or Spring Contact Probe needs.
Qualmax provides Semiconductor Test Socket, Spring Contact Probe, WLP Probe Card, Burn-in Test
Socket
and ATE Load Board (DUT Board)  to the semiconductor test industry.