Qualmax provides the most reliable & cost effective solution for Wafer Level
Package (WLP) Probe Card

Semiconductor IC Test Socket,  Burn-in Test Socket,  ATE Load Board,  WLP Probe Card, Spring Contact Probe

Wafer Probe Card for Wafer Level Package (WLP)

Wafer Level Package (WLP) gains more and more popularity in the electronics industry because of its
size, weight and signal integrity. The main driver is the mobile equipment right now, but it will also be
adapted by other products which require short signal path and high frequency characteristics.

Qualmax WLP probe card features Multi Layer Ceramic Interposer Board (MLCB), which was pioneered
by Leeno and proven in the field for its reliability. Leeno's MLCB provides a robust solution for down to
0.15mm pitch wafer level package (WLP) test. The vertical contact between the solder ball and the probe
is optimized by the precisely controlled spring force of spring contact probe, which is also manufactured
by Leeno, without leaving witness marks on the solder balls, even under the severe co-planarity problem.
Qualmax's wafer level package (WLP) probe card is the most reliable and cost effective solution for the
wafer level package test applications these days. Call us for the details!  

        
WLP Probe Card for a 0.25mm Pitch device

    
WLP Probe Card for a 0.3mm Pitch device

      
WLP Probe Card for a Logic Device

 
Pogo Pin Example for WLP Probe Card

  
The solid contact between the solder ball and the spring contact probe 

Qualmax also offers Burn-in Test Socket, ATE Load Board (DUT Board), WLP Probe Card and wide
range of Spring Contact Probe.